| 2025 | Business Development Plan 1. Short-Term Plan (1) Expand the business team, actively broaden the customer base, increase contact and learning with brand customers, strengthen product applicability, and include mobile phones, servers, e-sports, communication products, new energy, and chips as key projects this year. (2) Actively develop next-generation niche products and automated process technologies to strengthen competitive advantages. (3) Expand the global supply of thermal conductive components, aiming for a 2/3 market share in the global heat dissipation industry. 2. Long-Term Plan (1) Market components and modules globally, leveraging a strong marketing team to achieve global market leadership. (2) Improve the performance of existing raw materials, enhance heat pipe efficiency, develop new processes, participate more in industry exhibitions, introduce new technologies, develop new products, and expand equipment scale to reach the level of major international manufacturers in heat pipe production. (3) Plan overseas production sites and expand international division of labor to fully achieve the goals of sourcing resources efficiently, improving operational efficiency, reducing production costs, and refining product quality. (4) Utilize the combination of technology and humanity to respond to global environmental protection strategies, develop energy-saving and zero-pollution products, and fulfill our obligations as global citizens. (5) Gather world-class corporate culture and talent to fully grasp the future and create a sustainable business model. |
| 2024 | The R&D achievements are listed as follows, i. Analyzed raw materials like copper pipe, copper powder and metal braids to makes up the best composition of raw materials to improve product performance and competitiveness. ii. Development 6*0.2*0.25mm、6*0.2*0.15mm trench pipes and 10*1.0mm、12*1.0mm smooth tube pipes, which can reduce outsourcing requests and reduce costs. iii. Development of large diameter heat pipes (D10 and D12). Such products are mainly used in energy storage/vehicle/servo/NB. iv. Development of cylindrical flat-head heat pipes. This type of product is mainly used in the optical fiber module heat dissipation market. v. Development of VC products using copper powder as capillary structure. This product is mainly suitable for consumer electronic products, IGBT cooling modules and server cooling markets. vi. 7 patents have been applied for this year, among which 2 new patents have been authorized, the details are as follows: 6.1 Automatic rod threading machine (patent number: 202410726229.7 authorized) 6.2 Automatic rod threading machine (patent number: 202421291850.7 pending) 6.3 Automatic rod insertion, powder filling and tray insertion machine (patent number: 202421291840.3 authorized) 6.4 Heat pipe production process and heat pipe (patent number: 2024110763506 pending) 6.5 Capillary woven mesh rolling device (patent number: 202421907673.0 pending) 6.6 A copper powder wick and its preparation method (patent number: 2024113689425 pending) 6.7 Preparation process of porous spiral woven mesh wick and heat pipe (patent number: 202411946516.5 pending) vii. Development of automatic rod insertion and powder filling all-in-one machine，to improve the production yield and efficiency of heat pipes, and effectively reduce manpower and costs. viii. Developed a woven mesh rolling device to effectively control the width of the woven mesh and improve the production yield and efficiency of heat pipes. ix. Developed multi-spiral braided mesh to improve the production yield and efficiency of heat pipes. x. Developed heat pipes and spreader applied in the emerging applications like automotive, home appliances, drones, VR equipment as well as applications operating in the high- or low-temperature environment. The Company has continually enhanced its research and development capabilities and recruited R&D professionals. The future research and development focus is still on the improvement and enhancement of existing heat pipe products and production process and equipment of thin heat spreader as well as the development of dispersion products lighter and thinner in respond to the market demands. |
| 2021 | 08 April ,2021 BORIN INC. and YEH CHIANG TECHNOLOGY CORP. have cooperated for more than 10 years since 2009.In order to strengthen cooperation and expand the Korean market, both sides signed the agency agreement of South Korea. BORIN INC. KOREA :B503，230, Simin-daero, Dongan-gu, Anyang-si, Gyeonggi-do, Republic of Korea 14067 |
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